发明授权
- 专利标题: Process for exposing a photosensitive resin composition to light
- 专利标题(中): 将光敏树脂组合物曝光的方法
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申请号: US709964申请日: 1991-06-04
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公开(公告)号: US5330882A公开(公告)日: 1994-07-19
- 发明人: Chitoshi Kawaguchi , Seiji Arimatsu , Katsuji Konishi , Kazunori Kanda
- 申请人: Chitoshi Kawaguchi , Seiji Arimatsu , Katsuji Konishi , Kazunori Kanda
- 申请人地址: JPX Osaka
- 专利权人: Nippon Paint Co., Ltd.
- 当前专利权人: Nippon Paint Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX2-146614 19900605
- 主分类号: G03F7/20
- IPC分类号: G03F7/20 ; G03C5/00
摘要:
The present invention provides an improved process by which dissolved oxygen is effectively removed from a photosensitive resin layer of a photosensitive resin plate. The process comprises preliminarily exposing the photosensitive resin to light to quench oxygen dissolved in said photosensitive resin layer before conducting a main exposure. The photosensitive resin layer is prepared from a photosensitive resin composition which comprises:(a) a polymer binder,(b) a radically polymerizable monomer,(c) a sensitizing dye, and(d) a photopolymerization initiator which is excited by a light of a different wave length from a light exciting the sensitizing dye.The preliminary exposure is conducted with a light only exciting the sensitizing dye and the main exposure is conducted with a light exciting the photopolymerization initiator.
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