发明授权
US5330882A Process for exposing a photosensitive resin composition to light 失效
将光敏树脂组合物曝光的方法

Process for exposing a photosensitive resin composition to light
摘要:
The present invention provides an improved process by which dissolved oxygen is effectively removed from a photosensitive resin layer of a photosensitive resin plate. The process comprises preliminarily exposing the photosensitive resin to light to quench oxygen dissolved in said photosensitive resin layer before conducting a main exposure. The photosensitive resin layer is prepared from a photosensitive resin composition which comprises:(a) a polymer binder,(b) a radically polymerizable monomer,(c) a sensitizing dye, and(d) a photopolymerization initiator which is excited by a light of a different wave length from a light exciting the sensitizing dye.The preliminary exposure is conducted with a light only exciting the sensitizing dye and the main exposure is conducted with a light exciting the photopolymerization initiator.
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