发明授权
- 专利标题： Semiconductor device and method of manufacturing the same
- 专利标题（中）： 半导体装置及其制造方法
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申请号： US970372申请日： 1992-11-02
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公开(公告)号： US5338704A公开(公告)日： 1994-08-16
- 发明人: Atsushi Imai , Tuyoshi Hishida
- 申请人： Atsushi Imai , Tuyoshi Hishida
- 申请人地址： JPX Kyoto
- 专利权人： Rohm Co., Ltd.
- 当前专利权人： Rohm Co., Ltd.
- 当前专利权人地址： JPX Kyoto
- 优先权： JPX3-300371 19911115
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/60 ; H01L23/495 ; H01L23/50
摘要：
A conductive adhesive such as gold paste is coated and solidified on a lead provided on a frame for manufacture. Wire bonding between a semiconductor chip bonded to the frame and the lead provided thereon is effected between the semiconductor chip and a conductive adhesive layer solidified on the lead. It is thus possible to dispense with a conventional step of plating the frame (with gold) for effecting the wire bonding. In addition, it is possible to obtain reliable wire bonding irrespective of the kind of the base material of the frame or the surface roughness thereof. Further, it is possible to extremely simplify the process on the frame and save gold or like expensive material used as a plating material. Thus, it is possible to extremely reduce the cost of semiconductor device manufacture.
公开/授权文献
- US6101598A Methods for debugging a multiprocessor system 公开/授权日：2000-08-08