Invention Grant
- Patent Title: Method for encapsulating an integrated circuit using a removable heatsink support block
- Patent Title (中): 使用可拆卸散热器支撑块封装集成电路的方法
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Application No.: US949189Application Date: 1992-09-22
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Publication No.: US5344795APublication Date: 1994-09-06
- Inventor: Seyed H. Hashemi , Michael A. Olla , Thomas P. Dolbear , Richard D. Nelson
- Applicant: Seyed H. Hashemi , Michael A. Olla , Thomas P. Dolbear , Richard D. Nelson
- Applicant Address: TX Austin
- Assignee: Microelectronics And Computer Technology Corporation
- Current Assignee: Microelectronics And Computer Technology Corporation
- Current Assignee Address: TX Austin
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/433 ; H01L21/58 ; H01L21/60
Abstract:
A process for making thermosetting or thermoplastic encapsulated integrated circuit having a heat exchanger in which one end of the heat exchanger is encapsulated in the housing adjacent to the integrated circuit and the other end is exposed to the environment beyond the housing portion. The process of making includes molding a heat exchanger into a thermosetting or thermoplastic package utilizing a preformed heat exchanger having a dissolvable or removable material which serves as a seal block during the molding operation. A plurality of thermally conductive heat exchanger elements are provided for providing the desired thermal performance while reducing the thermal stresses in the package.
Public/Granted literature
- US6071369A Method for making an lithographic printing plate with improved ink-uptake Public/Granted day:2000-06-06
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