A cleaning compound for removing reactive polyurethane (PUR) hot melt adhesives from production and processing devices, machines and equipment which includes at least one reactive monofunctional hydroxyl compound which can react with the reactive isocyanate groups of the hot melt adhesive. The monohydroxy functional compound of the invention's cleaning compound completely saturates the remaining NCO groups of the hot melt adhesive to be removed, converting the adhesive into non-reactive, meltable compounds which are soluble in the cleaning compound.