Invention Grant
- Patent Title: Connector structure for modules in electronic apparatus
- Patent Title (中): 电子设备模块的连接器结构
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Application No.: US39242Application Date: 1993-04-26
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Publication No.: US5355282APublication Date: 1994-10-11
- Inventor: Hitoshi Yokemura , Masao Hosogai , Yuko Tsujimura
- Applicant: Hitoshi Yokemura , Masao Hosogai , Yuko Tsujimura
- Applicant Address: JPX Kanagawa
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JPX Kanagawa
- Priority: JPX3-219095 19910830
- Main IPC: H01R4/48
- IPC: H01R4/48 ; H05K1/14 ; H05K3/32 ; H05K3/36 ; H05K7/10 ; H05K7/02

Abstract:
An object of the present invention is to provide a connector structure for achieving a signal connection between modules not by way of a motherboard. In an electronic apparatus in which a plurality of modules (3, 4) are mounted on a motherboard (1) in an orderly manner, while flatly positioned parallel to the latter, and electrical connections between the modules and between the respective module and the motherboard are achieved by a connector body (2) extending along a boundary between the adjacent modules (3, 4), contacts (6, 7) are provided in the peripheral regions of the respective module (3, 4). Both the contacts (6, 7) are electrically connected with each other by pressing a connector spring (8) fixed in the connector body (2) onto the contacts (6, 7) provided in the peripheral regions of the adjacent modules (3. 4).
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