发明授权
- 专利标题: Ejector system for an IC pack connector apparatus
- 专利标题(中): 用于IC封装连接器装置的喷射器系统
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申请号: US82652申请日: 1993-06-25
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公开(公告)号: US5368493A公开(公告)日: 1994-11-29
- 发明人: Paul O'Brien , Mario Previato
- 申请人: Paul O'Brien , Mario Previato
- 申请人地址: IL Lisle
- 专利权人: Molex Incorporated
- 当前专利权人: Molex Incorporated
- 当前专利权人地址: IL Lisle
- 优先权: EPX92110895.7 19920626
- 主分类号: G06K17/00
- IPC分类号: G06K17/00 ; G06K13/08 ; H01R12/18 ; H01R13/633 ; H05K7/14 ; H01R13/62
摘要:
An ejector mechanism (10, 110, 210) is disclosed for use with a connector apparatus which includes a housing (12, 112, 212) into which an IC pack is loaded and from which it is ejected. The three part ejector mechanism also includes a one-piece eject lever (14, 114, 214) and a one-piece actuator (16, 116, 216). The eject lever is pivotally mounted on the housing for ejecting the IC pack from the housing. The actuator is movably mounted within an integrally molded channel (34, 138, 234) on the housing and is engageable with the eject lever to effect actuation thereof. Complementary interengaging portions of the housing, the eject lever and the actuator cooperate to effect the relative movements therebetween without the need of extraneous components.
公开/授权文献
- USD430559S Dial portion of an electronic device 公开/授权日:2000-09-05
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