发明授权
- 专利标题: MOS semiconductor device and method of fabricating the same
- 专利标题(中): MOS半导体器件及其制造方法
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申请号: US992829申请日: 1992-12-21
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公开(公告)号: US5371391A公开(公告)日: 1994-12-06
- 发明人: Yasuo Sato
- 申请人: Yasuo Sato
- 申请人地址: JPX Tokyo
- 专利权人: Nippon Steel Corporation
- 当前专利权人: Nippon Steel Corporation
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX3-355792 19911220
- 主分类号: H01L21/336
- IPC分类号: H01L21/336 ; H01L29/423 ; H01L29/49 ; H01L29/78 ; H01L23/00
摘要:
A first gate layer of a first conductor layer is formed on a gate oxide layer and selectively covered with a second gate layer of a second conductor layer. The first and second gate layers are used as a mask and a semiconductor substrate is thermally oxidized to thereby increase a thickness of a portion of the gate oxide layer except the gate layers and cover the second gate layer and the portion having the increased thickness of the gate oxide layer with a third conductor layer. Thereafter, a side wall of an insulating layer is formed on a side portion of the second gate layer and is used as a mask to form a third gate layer. The first, second and third gate layers and the side wall are used as a mask and impurity is introduced into the semiconductor substrate relatively heavily to thereby form a heavily doped impurity layer.
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