发明授权
- 专利标题： Upward soldering method
- 专利标题（中）： 向上焊接方式
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申请号： US149336申请日： 1993-11-09
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公开(公告)号： US5373985A公开(公告)日： 1994-12-20
- 发明人: Hiromu Chiba , Makoto Kobayashi
- 申请人： Hiromu Chiba , Makoto Kobayashi
- 申请人地址： JPX Kodama
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Kodama
- 优先权： JPX4-299490 19921110
- 主分类号： B23K1/005
- IPC分类号： B23K1/005 ; B23K101/42 ; H05K3/34
摘要：
A printed wiring board having an electronic component mounted thereon is disposed with a land of pattern directed downward, and the land and a lead terminal of the electronic component are irradiated with a light beam emitted upwardly and supplied with a solder forwarded upwardly.
公开/授权文献
- US4253066A Synchronous detection with sampling 公开/授权日：1981-02-24