发明授权
- 专利标题: Liquid coating system
- 专利标题(中): 液体涂层系统
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申请号: US144492申请日: 1993-11-01
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公开(公告)号: US5374312A公开(公告)日: 1994-12-20
- 发明人: Keizo Hasebe , Kiyohisa Tateyama , Yuji Yoshimoto , Yuji Matsuyama , Tetsuro Nakahara , Yoshio Kimura
- 申请人: Keizo Hasebe , Kiyohisa Tateyama , Yuji Yoshimoto , Yuji Matsuyama , Tetsuro Nakahara , Yoshio Kimura
- 申请人地址: JPX Tokyo JPX Kumamoto JPX Kawasaki
- 专利权人: Tokyo Electron Limited,Tokyo Electron Kyushu Limited,Kabushiki Kaisha Toshiba
- 当前专利权人: Tokyo Electron Limited,Tokyo Electron Kyushu Limited,Kabushiki Kaisha Toshiba
- 当前专利权人地址: JPX Tokyo JPX Kumamoto JPX Kawasaki
- 优先权: JPX3-006369 19910123; JPX3-009080 19910129
- 主分类号: B05C5/00
- IPC分类号: B05C5/00 ; B05C5/02 ; B05C11/08 ; G03F7/16 ; H01L21/20
摘要:
A liquid coating system according to the present invention comprises, a liquid supply source, a nozzle having an inlet communicating with the liquid supply source and a substantially linear liquid discharge portion, a pressure feed unit for feeding the liquid under pressure from the liquid supply source to the nozzle by means of compressed gas, a spin chuck for fixedly supporting a semiconductor wafer, an up-and-down cylinder for causing the liquid discharge portion of the nozzle to closely face the wafer on the spin chuck, and a rotating mechanism for rotating the spin chuck. The nozzle includes a liquid reservoir, in which the liquid supplied from the liquid supply source is collected, and a large number of small passages communicating with the liquid reservoir. The liquid coating system further comprises an air operation valve disposed in a communication passage between the inlet of the nozzle and the liquid supply source and used to reduce the pressure of the liquid fed under pressure to the liquid reservoir.
公开/授权文献
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