A receptacle configured for nested stacking with a lower receptacle of the same construction includes walls intersecting at corners and with a bottom to form a well having an open top bounded by a rim. The rim lies generally in a first plane and has an inner limit adjacent the well which defines a first area larger than the bottom to facilitate nested stacking. Each wall extends in a first direction generally perpendicular with the first plane toward the bottom to a juncture. The juncture defines a second area slightly larger than the first area so that the juncture extends outward from the well an overlap distance beyond the inner limit of the rim of the lower receptacle to establish a generally line-to-line interference with the rim of the lower receptacle. The receptacle also includes a respective juncture-bump, or deviation, at each corner deviating outward from the well at each corner. The juncture-bump traverses the line-to-line interference established by the juncture with the inner limit of the rim at two loci and extends an enhanced overlap distance beyond the line-to-line interference to establish two enhanced interference sites at each corner.