A special purpose modular receptacle comprises a generally rectangular housing having an opening which exposes a cavity within the housing. A plurality of electrical contacts are disposed within the cavity of the housing. Terminal ends of the contacts electrically connect to corresponding contacts on a standard modular connector or a modified modular connector inserted into the cavity. The contacts are exposed at a lower rear portion of the housing allowing connection between the contacts and a printed circuit board. Attachment means allow physical and electrical connection of the housing to a printed circuit board. A guiding means may be present as a modular connector insertion aid.