A hydrogen-absorbing alloy electrode comprises a conductive substrate, a layer of hydrogen-absorbing alloy granules disposed on the conductive substrate and a binder for binding the granules together and to the conductive substrate. A part of the granules is exposed on a surface of the layer on the electrode. The layer may have a predetermined thickness and the granules may include large size granules having a maximum diameter larger than half the thickness of the layer but smaller than the thickness of the layer. The granules may include first granules having a first average diameter and second granules having a second average diameter smaller than the first average diameter; the first granules may be 5 wt % or more but less than 20 wt % of the total weight of the granules.