发明授权
- 专利标题： Thermoelectric element sheet in which thermoelectric semiconductors are mounted between films
- 专利标题（中）： 热电半导体安装在膜之间的热电元件片
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申请号： US347212申请日： 1994-11-21
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公开(公告)号： US5430322A公开(公告)日： 1995-07-04
- 发明人: Tadamasa Koyanagi , Tsunehiro Oohira
- 申请人： Tadamasa Koyanagi , Tsunehiro Oohira
- 申请人地址： JPX Tokyo
- 专利权人： Agency of Industrial Science and Technology
- 当前专利权人： Agency of Industrial Science and Technology
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX4-265402 19920908
- 主分类号： G01K7/01
- IPC分类号： G01K7/01 ; B64G1/42 ; B64G1/44 ; G01K7/02 ; H01L35/32 ; H01L23/56
摘要：
A thermoelectric element sheet includes at least two layered structures having a plurality of thermoelectric elements which are arranged between insulating films. In each layered structure the thermoelectric semiconductors are arranged in pairs and electrodes connect the thermoelectric semiconductors of each pair to provide a plurality of structural units. Further electrodes connect the structural units. The thermoelectric element sheet can be used in thermoelectric energy conversion systems which depend on the Seebeck, Peltier or Thomson effect to convert thermal energy to electrical energy or vice versa.
公开/授权文献
- US5129091A Integrated-circuit card with active mode and low power mode 公开/授权日：1992-07-07