A slide bearing which is preferably used in combination with a low-rigid aluminum alloy housing. The slide bearing has a high coefficient of thermal expansion so that it can satisfactorily follow up deformation of the housing, and the bearing also has an excellent heat radiation property. In the slide bearing, an overly bearing layer having a thickness of 3 to 50 .mu.m is provided on a copper alloy layer having a coefficient of thermal expansion of 15.times.10.sup.-6 /.degree.C. or more, a coefficient of thermal conductivity of 0.40 cal/cm sec .degree.C. or more and 0.2% proof stress of 295N/mm.sup.2 or more. As occasion demands, the slide bearing may be (1) provided with an intermediate layer between the copper alloy layer and the overlay bearing layer, or (2) flash-plated on an entirety surface of the bearing.