发明授权
US5468997A Integrated circuit package having a multilayered wiring portion formed
on an insulating substrate
失效
集成电路封装，其具有形成在绝缘基板上的多层布线部
- 专利标题： Integrated circuit package having a multilayered wiring portion formed on an insulating substrate
- 专利标题（中）： 集成电路封装，其具有形成在绝缘基板上的多层布线部
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申请号： US368384申请日： 1994-12-30
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公开(公告)号： US5468997A公开(公告)日： 1995-11-21
- 发明人: Ryuji Imai , Rokuro Kanbe
- 申请人： Ryuji Imai , Rokuro Kanbe
- 申请人地址： JPX Aichi
- 专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人： NGK Spark Plug Co., Ltd.
- 当前专利权人地址： JPX Aichi
- 优先权： JPX3-137949 19910610
- 主分类号： H01L23/538
- IPC分类号： H01L23/538 ; H01L23/522 ; H01L23/48 ; H01L29/41
摘要：
An integrated circuit package in which three conductor columns for connecting an insulating substrate and an integrated circuit are connected in parallel for use as I/O vias. Thereby, the conductor columns in a multilayer wiring portion between an integrated circuit and an insulating substrate is prevented from disconnecting.
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