A thermal printhead is provided which comprises an insulating head substrate, a conductor pattern formed on the head substrate, a row of heating dots formed on the head substrate in electrical conduction with the conductor pattern, an array of drive ICs mounted on the head substrate and spaced from the row of heating dots, a resin body enclosing the array of drive ICs, and a protective coating covering the conductor pattern together with the row of heating dots. The protective coating comprises a smaller thickness portion at least at the row of heating dots, and a larger thickness portion held in contact with the resin body and extending to a position short of the row of heating dots.