To provide a cleaning method and a cleaning apparatus for decreasing the total cost by producing high-performance semiconductor using silicon wafers with cleaner surface, decreasing the semiconductor production cost, decreasing the consumption of chemical solutions and the cleaning time by using a new cleaning method and apparatus, simplifying the recovery of waste liquids, and decreasing equipment investment.A cleaning method having a plurality of chemical-solution-cleaning processes characterized by performing a chemical-solution-cleaning process for continuously feeding a chemical solution to the surface of an object to be cleaned from an upper part of the object surface by horizontally setting the object in a cleaning bath, closing the bath, and then rotating the object and an ultrapure-water-cleaning process for feeding ultrapure water in order for each chemical solution in the same cleaning bath; and thereafter drying the object after cleaning it.