发明授权
- 专利标题: Hydrogen out venting electronic package
- 专利标题(中): 氢气排气电子封装
-
申请号: US324070申请日: 1994-10-14
-
公开(公告)号: US5491361A公开(公告)日: 1996-02-13
- 发明人: Gary W. Stupian , Martin S. Leung
- 申请人: Gary W. Stupian , Martin S. Leung
- 申请人地址: CA El Segundo
- 专利权人: The Aerospace Corporation
- 当前专利权人: The Aerospace Corporation
- 当前专利权人地址: CA El Segundo
- 主分类号: G02B6/44
- IPC分类号: G02B6/44 ; H01L23/10 ; H01L23/02
摘要:
A hydrogen out venting window is disposed on or in a hermetically sealed electronic package lid, the window including a catalyst which dissociates internally trapped molecular hydrogen at an interior surface of the catalyst into atomic hydrogen and which recombines the atomic hydrogen back into molecular hydrogen at an exterior surface of the catalyst with the atomic hydrogen diffusing from the interior surface to the exterior surface to vent out the molecular hydrogen from the interior of the package to the exterior of the package, the window taking various forms including a catalyst sandwich with the package lid disposed between an interior catalysis plate and an exterior catalysis plate, a plate window with a catalysis covering plate disposed over a hole in the package lid, a plug window having a catalysis plug disposed in a hole in the package lid, or a lid window where the package lid is the catalyst, the catalyst being a suitable transition metal such as pallidium or platinum, or alloy, disposed on or in or as the electronic package lid.
公开/授权文献
信息查询