发明授权
- 专利标题： Thermocouple
- 专利标题（中）： 热电偶
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申请号： US325536申请日： 1991-10-07
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公开(公告)号： US5498296A公开(公告)日： 1996-03-12
- 发明人: Kazuo Sawada , Shinji Inazawa , Kouichi Yamada
- 申请人： Kazuo Sawada , Shinji Inazawa , Kouichi Yamada
- 申请人地址： JPX Osaka
- 专利权人： Sumitomo Electric Industries, Ltd.
- 当前专利权人： Sumitomo Electric Industries, Ltd.
- 当前专利权人地址： JPX Osaka
- 优先权： JPX2-213366 19900809; JPX3-181096 19910722; JPX3-182604 19910723
- 主分类号： H01L35/20
- IPC分类号： H01L35/20 ; H01L35/32 ; H01L35/34 ; H01L35/12
摘要：
A metal oxide layer is provided around a thermocouple element. The metal oxide layer is formed by preparing a sol, in which particulates of a metal oxide are dispersed, by a sol-gel method, dipping the thermocouple element in this sol, energizing the thermocouple element as a cathode for bonding the precursor particulates of the metal oxide thereto, and heat treating the same. The thermocouple according to the present invention is compact with a thin insulating layer, excellent in flexibility, and provides no gas adsorption source.
公开/授权文献
- US4956014A Electroless copper plating solution 公开/授权日：1990-09-11
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