发明授权
- 专利标题: Manufacturing process for grooved substrates and multilayer structure
- 专利标题(中): 开槽基板和多层结构的制造工艺
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申请号: US311296申请日: 1994-09-23
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公开(公告)号: US5498445A公开(公告)日: 1996-03-12
- 发明人: Werner Steiner , Gerhard Trippel
- 申请人: Werner Steiner , Gerhard Trippel
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Inc.
- 当前专利权人: International Business Machines Inc.
- 当前专利权人地址: NY Armonk
- 优先权: EPX9011578.6 19900817
- 主分类号: B05D1/40
- IPC分类号: B05D1/40 ; B05D7/24 ; B29C43/18 ; B29D17/00 ; B29K83/00 ; B29L17/00 ; G11B7/26 ; B05D5/06
摘要:
Grooved substrates and multilayer structures, especially suitable for optical disks, are taught. The major process steps include spin coating of a supporting plate with dissolved material forming a soft layer thereon, stamping grooves into the soft layer to form a structured soft layer showing the negative image of the stamp and hardening the structured soft layer by thermal treatment. The dissolved material contains polymeric organometal compounds comprising polymer siloxane and/or polymer silicates. In one embodiment the structured soft layer is a dielectric layer containing various combinations of the oxides SiO.sub.2, La.sub.2 O.sub.3, PbO and TiO.sub.2. The multilayer structure completed by a magneto-optic layer, a reflector layer and a passivation layer.
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