发明授权
US5508565A Semiconductor device having a plurality of chips having identical
circuit arrangement sealed in package
失效
具有密封在封装中的具有相同电路布置的多个芯片的半导体器件
- 专利标题： Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package
- 专利标题（中）： 具有密封在封装中的具有相同电路布置的多个芯片的半导体器件
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申请号： US355985申请日： 1994-12-14
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公开(公告)号： US5508565A公开(公告)日： 1996-04-16
- 发明人: Atsushi Hatakeyama , Fumio Baba , Junichi Kasai , Mitsutaka Sato
- 申请人： Atsushi Hatakeyama , Fumio Baba , Junichi Kasai , Mitsutaka Sato
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L25/065 ; H01L23/48
摘要：
A semiconductor device includes a first chip having a circuit arrangement, and a plurality of first terminals formed on a main surface of the first chip and substantially arranged into a line. The semiconductor device also includes a second chip having a circuit arrangement identical to that of the first chip, and a plurality of second terminals formed on a main surface of the second chip and substantially arranged into a line. The first and second chips are arranged in a predetermined direction perpendicular to the main surfaces of the first and second chips. The semiconductor device also includes a plurality of connecting members connected to the first terminals and the second terminals and provided for external connections.
公开/授权文献
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