发明授权
US5516824A Solvent-free laminating adhesive composition 失效
无溶剂层压粘合剂组合物

Solvent-free laminating adhesive composition
摘要:
A laminating adhesive comprising an adhesive composition which comprises(a) An epoxidized block copolymer of the formula(A-B-A.sub.p).sub.n -Y.sub.r -(A.sub.q -B).sub.mwherein Y is a coupling agent or coupling monomers, andwherein A and B are polymer blocks which may be homopolymer blocks of conjugated diolefin monomers, copolymer blocks of conjugated diolefin monomers or copolymer blocks of conjugated diolefin monomers and monoalkenyl aromatic hydrocarbon monomers, andwherein the A blocks have a higher number of aliphatic double bonds between a tertiary carbon atom and either a primary, secondary, or tertiary carbon atom per unit of block mass than do the B blocks, andwherein the A blocks have a molecular weight from about 100 to about 3000 and the B blocks have a molecular weight from about 1000 to about 15,000, and wherein p and q are 0 or 1 and n>0, r is 0 or 1, m.gtoreq.0 and n+m ranges from 1 to 100; and(b) at least a significant amount of a tackifying resin compatible with the polymer of (a) up to 400 phr.The invention also relates to a laminate containing the adhesive.
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