A tape automated bonded circuit comprising a flexible substrate having an opening defined by a peripheral sidewall. A plurality of conductive traces are provided on the flexible substrate which terminate in a plurality of leads which extend into alignment with the opening. An electronic device having a plurality of pad regions is aligned with the opening in the substrate. The leads are bonded to the pad regions. A continuous encapsulation layer which touches the peripheral side wall of the substrate opening on all sides encapsulatingly covers the bonded leads and pad regions and structurally reinforces each lead along the entire length which projects over the opening.