A chip component supply apparatus of the invention includes a container box for storing chip components in pieces, a means for conveying chip components from the container box onto a conveyor belt, which moves intermittently and conveys the transferred chip components toward a take-out port area where a vacuum suction nozzle of an electronic component placement machine takes out the chip components. A stopper is positioned in the vicinity of the take-out port area for stopping the chip components conveyed by the conveyor belt at the take-out port area. The stopper moves and departs from the vicinity of the take-out port area when the conveyor belt finishes intermittent motion and stops, and returns and is positioned at the take-out port area before the next chip component conveyed by next intermittent motion of the conveyor belt reaches the take-out port area. The vacuum suction nozzle of the electronic component placement machine takes out the chip component at the take-out port area when the conveyor belt is stopped and the stopper is apart from the take-out port area.