Chip capacitors are attached to an integrated circuit package. Strips of synthetic tape are placed between pairs of chip capacitor pads on the integrated circuit package. The strips of synthetic tape each have a height extending above height of the pairs of chip capacitor pads. In the preferred embodiment, the strips of synthetic tape are strips of polyimide tape. The height of the strips of synthetic tape is selected so that the chip capacitors will be installed at a sufficient distance from the integrated circuit package so that solder balls will not be of sufficient diameter to wedge between the integrated circuit package and the chip capacitors. The chip capacitors are installed over the pairs of chip capacitor pads. The chip capacitors rest on the strips of synthetic tape. For example, the chip capacitors are permanently attached to the pairs of chip capacitors using a solder process. A reflow solder process is then performed. Afterwards, the strips of synthetic tape are removed from the integrated circuit package. After removal of the strips of synthetic tape, a cleaning of area under the chip capacitors may be performed to remove any material under and around the chip capacitors.