发明授权
- 专利标题： Cooling device for integrated circuit element
- 专利标题（中）： 集成电路元件冷却装置
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申请号： US366728申请日： 1994-12-30
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公开(公告)号： US5537291A公开(公告)日： 1996-07-16
- 发明人: Yasushi Onodera , Akira Ueda
- 申请人： Yasushi Onodera , Akira Ueda
- 申请人地址： JPX Kanagawa
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kanagawa
- 优先权： JPX6-047162 19940317
- 主分类号： H01L23/473
- IPC分类号： H01L23/473 ; H05K7/20
摘要：
The cooling device including a cold plate having an inside water passage through which a cooling water passes and having one surface provided with a cooling element corresponding to an integrated circuit element, a housing for fixing the cold plate to a substrate so that the cooling element is kept in close contact with the integrated circuit element, and a water leakage sensor provided inside the housing, is disclosed.
公开/授权文献
- US6061077A Thermal head 公开/授权日：2000-05-09
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