A method for drying semiconductor wafers produces ultra-clean wafers without conventional drying chemicals. The method involves slowing draining a rinsing fluid from a processing tank while heating the wafer at the fluid interface as the wafer emerges from the rinsing fluid. The portion of the wafer surface at the fluid interface is heated to a temperature greater than the rinsing fluid to drive contaminant particles away from the wafer surface. An apparatus for performing this drying method also is provided.