发明授权
- 专利标题： Method for aligning a semiconductor device
- 专利标题（中）： 半导体器件对准方法
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申请号： US268986申请日： 1994-06-30
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公开(公告)号： US5556808A公开(公告)日： 1996-09-17
- 发明人: William M. Williams , Barbara Vasquez , Marlene J. Begay , Patrick Thompson
- 申请人： William M. Williams , Barbara Vasquez , Marlene J. Begay , Patrick Thompson
- 申请人地址： IL Schaumburg
- 专利权人： Motorola Inc.
- 当前专利权人： Motorola Inc.
- 当前专利权人地址： IL Schaumburg
- 主分类号： H01L21/58
- IPC分类号： H01L21/58 ; H01L29/06 ; H01L21/60
摘要：
A system and method for aligning a semiconductor device (10) to a fixture (11) is provided. A first physical alignment feature (12) on the semiconductor device (10) and a second physical alignment (24) on the fixture (11) mate to align and hold the semiconductor device (10) in place. In one embodiment the physical alignment features (12) and (24) are produced using standard photolithography techniques, resulting in precise alignment features. In another embodiment the physical alignment features (12) and (24) are designed and placed to control the direction the thermal expansion of the semiconductor device (10) relative to the fixture (11).