发明授权
- 专利标题： Electronic component enclosure for RF shielding
- 专利标题（中）： 用于射频屏蔽的电子元件外壳
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申请号： US176637申请日： 1994-01-03
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公开(公告)号： US5557063A公开(公告)日： 1996-09-17
- 发明人: Behzad D. Mottahed
- 申请人： Behzad D. Mottahed
- 申请人地址： NJ Murray Hill
- 专利权人： Lucent Technologies Inc.
- 当前专利权人： Lucent Technologies Inc.
- 当前专利权人地址： NJ Murray Hill
- 主分类号： H05K9/00
- IPC分类号： H05K9/00
摘要：
Improved RF shielding is disclosed. The shielding provides a joint seal that can eliminate the soldering, and the screws and gaskets, otherwise required for securing RF shield caps and walls to reduce EMI. Conductive shield caps that can be simply snap fit against the groundplane are also disclosed.
公开/授权文献
- US4883916A Polyprenyl Compounds 公开/授权日：1989-11-28
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