发明授权
- 专利标题： Method for forming a protective chemical layer on copper and copper alloy surfaces
- 专利标题（中）： 在铜和铜合金表面上形成保护化学层的方法
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申请号： US520477申请日： 1995-08-29
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公开(公告)号： US5560785A公开(公告)日： 1996-10-01
- 发明人: Hirohiko Hirao , Yoshimasa Kikukawa , Toshihiro Okamoto , Takayuki Murai , Seiji Sogabe , Miya Tanioka , Rie Nakayama , Takashi Yoshioka
- 申请人： Hirohiko Hirao , Yoshimasa Kikukawa , Toshihiro Okamoto , Takayuki Murai , Seiji Sogabe , Miya Tanioka , Rie Nakayama , Takashi Yoshioka
- 申请人地址： JPX Marugame
- 专利权人： Shikoku Chemicals Corporation
- 当前专利权人： Shikoku Chemicals Corporation
- 当前专利权人地址： JPX Marugame
- 优先权： JPX5-132998 19930510; JPX6-65502 19940308
- 主分类号： C23F11/10
- IPC分类号： C23F11/10 ; C23F11/14 ; H05K3/28 ; C23C22/06
摘要：
A water-based surface treatment agent is used to provide a chemical layer on a copper or copper alloy printing wiring board (PWB). The chemical layer shows excellent heat-resistance and moisture-resistance. The treated PWB maintains excellent solderability for extended lengths of time. The water-based surface treatment agent contains as an active ingredient 2,4-diphenylimidazole, 2,4-diphenyl-5-methylimidazole or 2-phenyl-4-benzyl-5-methylimidazole. The treating compositions with a lower carboxylic acid of up to 4 carbon atoms are soluble in water, and have improved solder wetting properties and improved solder paste spreading property. A copper compound may be included in the aqueous solution to increase the rate at which the chemical layer is formed.
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