发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US351383申请日： 1995-03-13
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公开(公告)号： US5563445A公开(公告)日： 1996-10-08
- 发明人: Yoshitaka Iijima , Shigeaki Seki
- 申请人： Yoshitaka Iijima , Shigeaki Seki
- 申请人地址： JPX Tokyo
- 专利权人： Seiko Epson Corporation
- 当前专利权人： Seiko Epson Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX5-082207 19930408
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L21/607 ; H01L23/28 ; H01L23/31 ; H01L23/495 ; H01L23/48 ; H01L23/04 ; H01L23/52
摘要：
A semiconductor chip is positioned over the device hole of a circuit board which includes an insulating flexible substrate. The electrode bumps of the semiconductor chip are bonded to the lead portions of the conductive pattern, which protrude into the device hole by using the single-point bonding method. The circuit board includes superimposing areas of the substrate that overlie the semiconductor chip at the four corner areas of the device hole, as well as the superimposing area that divides the device hole into the four holes. Dummy bumps are provided on the areas of the semiconductor chip that overlap these superimposing areas. The dummy bumps are not to be bonded to the conductive pattern and are positioned between the circuit board and the semiconductor chip to maintain a specified distance between the two. Furthermore, a through-hole is provided in the superimposing area to allow air to escape when a molding agent is injected through the holes.