发明授权
- 专利标题: Spring grounding clip for computer peripheral card
- 专利标题(中): 电脑周边卡的弹簧接地夹
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申请号: US379825申请日: 1995-01-27
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公开(公告)号: US5563450A公开(公告)日: 1996-10-08
- 发明人: Ronald S. Bader , Michael W. Patterson
- 申请人: Ronald S. Bader , Michael W. Patterson
- 申请人地址: CA Santa Clara
- 专利权人: National Semiconductor Corporation
- 当前专利权人: National Semiconductor Corporation
- 当前专利权人地址: CA Santa Clara
- 主分类号: H01R13/648
- IPC分类号: H01R13/648 ; H05K5/00 ; H05K5/02 ; H05K9/00 ; H01L23/02 ; H01L23/34
摘要:
A peripheral card includes a two-part metal cover mounting a printed wiring board on a U-shaped plastic frame. The wiring board is spaced from inside surfaces of the cover preferably by a pair spring clips mountable on side edges of the wiring board, each clip having an apertured intermediate bight portion overlying and in aperture burr scraped contact with ground contact pads on the board. Barbed-end spring fingers extend integrally from the bight portion preferably toward the board side edge to which it affixed and into scraped contact with respective ones of the metal cover parts as the metal cover parts are assembled together. The clips hold the board from movement in the cover and electrically ground any static electrical charges on the metal cover parts to the contact pads and to a ground socket in the frame, and electrically ground the metal cover parts to provide electromagnetic shielding of the electrical circuitry on the wiring board.
公开/授权文献
- US5057546A Semi-flexible or flexible phenolic foam composition 公开/授权日:1991-10-15
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