Semiconductor chip manufacturing methods and devices are disclosed which store dicing data corresponding to the kinds of wafers, when data indicating the wafer kinds are input, read out the dicing data corresponding to the data input, and cut a wafer set at a given position to a desired shape in accordance with the dicing data to thereby manufacture a semiconductor chip. The manufacturing methods and devices include read means for inputting the data indicating the wafer kinds. According to the manufacturing method and device, a symbol indicating the kind of the wafer is recorded as an identification symbol readable by the read means and on a member moving together with the wafer in a chip manufacturing process that is not part of the product being manufactured, and preferably, is also not part of a recyclable carrier for the wafer to be diced. When the data indicating the kind of the wafer is input, the identification symbol recorded in the above-mentioned member is read out by the read means.