发明授权
- 专利标题： Advanced technique for packaging multiple number of electrically stackable high voltage transistors in one package
- 专利标题（中）： 在一个封装中封装多个可电叠置的高压晶体管的先进技术
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申请号： US581385申请日： 1995-12-29
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公开(公告)号： US5577617A公开(公告)日： 1996-11-26
- 发明人: Mohammad M. Mojarradi , Dennis W. Sandstrom , Tuan A. Vo , Abdul Elhatem
- 申请人： Mohammad M. Mojarradi , Dennis W. Sandstrom , Tuan A. Vo , Abdul Elhatem
- 申请人地址： CT Stamford
- 专利权人： Xerox Corporation
- 当前专利权人： Xerox Corporation
- 当前专利权人地址： CT Stamford
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; B65D73/02
摘要：
High voltage circuitry often requires assembling an array of high voltage devices that are electrically isolated from one another. A lead frame that fits within conventional plastic packaging has been designed that will allow electrical isolation of the substrates of two or more transistors mounted together in a single package.
公开/授权文献
- US5123013A Cell synchronizing apparatus and method 公开/授权日：1992-06-16
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