An electrical socket is disclosed for interfacing between a printed circuit board having contact pads and an electronic module having external leads, such as an integrated circuit. The electrical socket includes a base frame, containing an opening generally conforming to the body shape and size of the electronic module, and a plurality of spaced, parallel conductive members, such as electrical wires, arrayed on a resilient strip coextensive with at least part of the surface of the opening. Each conductive member includes both a lead portion in adjacent parallel relationship with one of the electronic module external leads and a contact portion in electrical engagement with a contact pad, and may also include a retaining portion for securing the conductive member to the resilient strip. The electrical socket may include a cover, with thermal vent holes, to secure the electronic module within the base frame opening.