发明授权
US5587882A Thermal interface for a heat sink and a plurality of integrated circuits
mounted on a substrate
失效
用于散热器的热接口和安装在基板上的多个集成电路
- 专利标题： Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
- 专利标题（中）： 用于散热器的热接口和安装在基板上的多个集成电路
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申请号： US521480申请日： 1995-08-30
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公开(公告)号： US5587882A公开(公告)日： 1996-12-24
- 发明人: Chandrakant Patel
- 申请人： Chandrakant Patel
- 申请人地址： CA Palo Alto
- 专利权人： Hewlett-Packard Company
- 当前专利权人： Hewlett-Packard Company
- 当前专利权人地址： CA Palo Alto
- 主分类号： H01L23/36
- IPC分类号： H01L23/36 ; H01L23/367 ; H01L25/065 ; H05K7/20
摘要：
A referencing scheme provides a thermal interface between a heat sink and chips within a MultiChip Module (MCM). The referencing scheme comprises a heat sink with a support ring that penetrates a trough formed within a substrate of the MCM. A thermal transfer medium positioned between the heat sink and the chips forms a thermal interface having a low thermal resistance. This cools the chips and ensures reliable operation of the MCM. The trough is filled with a curable adhesive, securing the heat sink to the substrate of the MCM.
公开/授权文献
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