In a method and system for repairing a resin-impregnated article having one or more dry spots or resin-depleted areas, a mold release is used to coat all surfaces of the defective article, except for the resin-depleted areas and a border area surrounding and contiguous to each resin-depleted area. The coated article is then placed within a mold cavity defined by a two-piece mold and corresponding in shape and size to the article. A plurality of shims are interposed in the parting line between the two halves of the mold, creating a first gap within the parting line and a second gap between the surfaces of the article and the walls defining the mold cavity. A gasket is also seated between the two halves of the mold to seal the mold cavity, and a vacuum pump is coupled to the mold cavity to evacuate the cavity to a negative pressure. Heated, substantially degassed resin is then injected into the mold cavity, which flows through the second gap over the coated surfaces of the article and into the resin-depleted areas to impregnate the depleted areas. The shims are then removed and the two halves of the mold are brought into engagement to substantially close the first and second gaps and squeeze excess resin from the mold cavity. The article is then heat treated within the mold cavity to cure the impregnated resin.