发明授权
- 专利标题: Alloy sheet having high etching performance
- 专利标题(中): 具有高蚀刻性能的合金板
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申请号: US153890申请日: 1993-11-17
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公开(公告)号: US5605582A公开(公告)日: 1997-02-25
- 发明人: Tadashi Inoue , Hidekazu Yoshizawa , Kiyoshi Tsuru , Yoshiaki Shimizu , Tomoyoshi Okita
- 申请人: Tadashi Inoue , Hidekazu Yoshizawa , Kiyoshi Tsuru , Yoshiaki Shimizu , Tomoyoshi Okita
- 申请人地址: JPX Tokyo
- 专利权人: NKK Corporation
- 当前专利权人: NKK Corporation
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX4-032939 19920124; JPX5-40714 19920131; JPX5-201879 19930722; JPX5-206628 19930820
- 主分类号: C22C38/08
- IPC分类号: C22C38/08 ; H01J29/07 ; G03C5/00
摘要:
An alloy sheet having a pierced hole face and providing a desirable etching performance, comprising {331}, {210}, and {211} planes on the surface; the gathering degree of the {311} plane being 14% or less, the gathering degree of the {210} plane being 14% or less, and the gathering degree of the {211} plane being 14% or less; and the ratio of the gathering degrees expressed by the equation {210}/({331}+{211}) being 0.2 to 1. An alloy sheet having a pierced hole face providing a desirable etching performance, comprising planes of {111}, {100}, {110}, {311}, {331}, {210} and {211}; the gathering degree of the {111} plane, S.sub.1, being 1 to 10%, the gathering degree of the {100} plane, S.sub.2, being 50 to 94%, the gathering degree of the {110} plane, S.sub.3, being 1 to 24%, the gathering degree of the {311} plane, S.sub.4, being 1 to 14%, the gathering degree of the {331} plane, S.sub.5, being 1 to 14%, the gathering degree of the {210} plane, S.sub.6, being 1 to 14%, the gathering degree of the {211} plane, S.sub.7, being 1 to 14%; and the ratio of gathering degrees expressed by the equation (S.sub.2 +S.sub.4 +S.sub.6)/(S.sub.1 +S.sub.3 +S.sub.5 +S.sub.7) being 0.8 to 20.
公开/授权文献
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