- 专利标题： Co-sintered surface metallization for pin-join, wire-bond and chip attach
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申请号： US360526申请日： 1994-12-21
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公开(公告)号： US5613181A公开(公告)日： 1997-03-18
- 发明人: Govindarajan Natarajan , Srinivasa S. N. Reddy
- 申请人： Govindarajan Natarajan , Srinivasa S. N. Reddy
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： C03C17/36
- IPC分类号： C03C17/36 ; C04B41/52 ; C04B41/89 ; C23C26/00 ; H01L21/48 ; H01L23/373 ; B22F7/02 ; B22F7/04
摘要：
A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.
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