发明授权
- 专利标题： Electroless gold plating solution
- 专利标题（中）： 化学镀金液
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申请号： US514603申请日： 1995-08-14
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公开(公告)号： US5614004A公开(公告)日： 1997-03-25
- 发明人: Hiroshi Wachi , Yutaka Otani
- 申请人： Hiroshi Wachi , Yutaka Otani
- 申请人地址： JPX Tokyo
- 专利权人： Electroplating Engineers of Japan, Limited
- 当前专利权人： Electroplating Engineers of Japan, Limited
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX6-195351 19940819
- 主分类号： C23C18/44
- IPC分类号： C23C18/44 ; C23C18/31
摘要：
The present invention provides an electroless gold plating solution which does not precipitate gold at high concentrations of thallium or lead compound, while retaining its effects such as increased deposition rate and larger crystallite sizes in the deposited layer. The electroless gold plating solution according to the invention contains 0.1-10 g/l of a chelating agent, such as diethylenetriaminetetraacetic acid (DTPA), ethylenediaminetetraacetic acid or nitrilotriacetic acid, DTPA being a preferable agent.
公开/授权文献
- US5069782A Fluid purification systems 公开/授权日：1991-12-03
信息查询
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