发明授权
- 专利标题： Tape carrier package semiconductor device
- 专利标题（中）： 带载封装半导体器件
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申请号： US386051申请日： 1995-02-07
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公开(公告)号： US5614760A公开(公告)日： 1997-03-25
- 发明人: Mitsuaki Osono , Naoyuki Tajima , Katsunobu Mori
- 申请人： Mitsuaki Osono , Naoyuki Tajima , Katsunobu Mori
- 申请人地址： JPX Osaka
- 专利权人： Sharp Kabushiki Kaisha
- 当前专利权人： Sharp Kabushiki Kaisha
- 当前专利权人地址： JPX Osaka
- 优先权： JPX6-141584 19940623
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; H01L21/56 ; H01L23/28 ; H01L23/495 ; H01L23/34 ; H01L23/48
摘要：
In a TCP (tape carrier package) semiconductor device having opposing, inner lead arrays bonded to a semiconductor device, a projection or projections are provided on each of the inner leads disposed at intervals of a greater distance on one side of the semiconductor, within a range for allowing the resin to flow out.
公开/授权文献
- US4482374A Production of electrically conductive metal flake 公开/授权日：1984-11-13
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