发明授权
- 专利标题： Etching of copper-containing devices
- 专利标题（中）： 含铜设备的蚀刻
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申请号： US219686申请日： 1994-03-28
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公开(公告)号： US5620558A公开(公告)日： 1997-04-15
- 发明人: Karrie J. Hanson , Barry Miller , Barbara J. Sapjeta , Akshay V. Shah , Ken M. Takahashi
- 申请人： Karrie J. Hanson , Barry Miller , Barbara J. Sapjeta , Akshay V. Shah , Ken M. Takahashi
- 申请人地址： NJ Murray Hill
- 专利权人： Lucent Technologies Inc.
- 当前专利权人： Lucent Technologies Inc.
- 当前专利权人地址： NJ Murray Hill
- 主分类号： B01D19/04
- IPC分类号： B01D19/04 ; C11D1/722 ; C11D3/00 ; C23F1/18 ; H01L21/3213 ; H01L21/48 ; H01L23/538 ; H05K3/06 ; H05K3/38 ; C23F1/02 ; H01L21/00
摘要：
The linewidth in patterns produced by etching copper layers is more easily maintained using a specific etching medium. In particular, this medium includes aqueous hydrofluoric acid, copper chloride, and an additional chloride salt. The etching medium is also particularly useful for bilayer metal constructions such as the copper/titanium structure found in many multichip modules.
公开/授权文献
- US3946730A Biomedical electrode assembly 公开/授权日：1976-03-30
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