发明授权
- 专利标题: Composite plating apparatus and apparatus for dispersing air bubbles within a composite plating solution
- 专利标题(中): 复合电镀装置和用于在复合电镀液中分散气泡的装置
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申请号: US364320申请日: 1994-12-27
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公开(公告)号: US5620575A公开(公告)日: 1997-04-15
- 发明人: Hitoshi Karasawa , Hiroyuki Nomura , Hisayuki Sakurai
- 申请人: Hitoshi Karasawa , Hiroyuki Nomura , Hisayuki Sakurai
- 申请人地址: JPX
- 专利权人: Honda Giken Kogyo Kabushiki Kaisha
- 当前专利权人: Honda Giken Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX
- 优先权: JPX5-348610 19931227; JPX5-348611 19931227
- 主分类号: C25D7/04
- IPC分类号: C25D7/04 ; C25D15/02
摘要:
A composite plating apparatus is disclosed in which an insertion electrode is loosely inserted into a hollow cylinder having a space, air bubbles are mixed into a composite plating solution fed from a liquid feeding pipe toward the space in the cylinder, and the hollow cylinder is connected to a base electrode so as to perform a composite plating on the inner surface of the hollow cylinder. An air bubble dispersing member having at least one passage hole with a diameter the same as or larger than a length of a gap defined between the insertion electrode and the inner surface of the cylinder is arranged upstream of a plating solution inlet portion of the hollow cylinder as an apparatus for dispersing air bubbles within the composite plating solution. The air bubble dispersing member can also be used as an electrode engaging member for engaging a tip end portion of the electrode inserted into the hollow cylinder.
公开/授权文献
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