发明授权
- 专利标题： Apparatus for cooling of chips using a plurality of customized thermally conductive materials
- 专利标题（中）： 使用多种定制导热材料冷却芯片的装置
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申请号： US690883申请日： 1996-08-02
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公开(公告)号： US5623394A公开(公告)日： 1997-04-22
- 发明人: Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
- 申请人： Raed A. Sherif , Mark G. Courtney , David L. Edwards , Albert J. Fahey , Gregory S. Hopper , Sushumna Iruvanti , Charles F. Jones , Gaetano P. Messina
- 申请人地址： NY Armonk
- 专利权人： International Business Machines Corporation
- 当前专利权人： International Business Machines Corporation
- 当前专利权人地址： NY Armonk
- 主分类号： H01L23/373
- IPC分类号： H01L23/373 ; H01L23/42 ; H01L23/64 ; H01L25/065 ; H05K7/20
摘要：
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.