发明授权
US5628919A Methods for producing a chip carrier and terminal electrode for a
circuit substrate
失效
用于制造用于电路基板的芯片载体和端子电极的方法
- 专利标题： Methods for producing a chip carrier and terminal electrode for a circuit substrate
- 专利标题（中）： 用于制造用于电路基板的芯片载体和端子电极的方法
-
申请号： US439980申请日： 1995-05-12
-
公开(公告)号： US5628919A公开(公告)日： 1997-05-13
- 发明人: Yoshihiro Tomura , Yoshihiro Bessho , Yasuhiko Hakotani
- 申请人： Yoshihiro Tomura , Yoshihiro Bessho , Yasuhiko Hakotani
- 申请人地址： JPX Kadoma
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Kadoma
- 优先权： JPX5-311980 19931213; JPX5-314966 19931215; JPX5-320117 19931220; JPX5-320126 19931220
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H01L21/56 ; H01L23/485 ; H01L23/498 ; H05K1/18 ; H05K3/24 ; H05K3/32 ; H05K3/40 ; B44C1/22
摘要：
A chip carrier according to the present invention includes: a carrier body including an upper face, a lower face, and an internal conductor; and a plurality of terminal electrodes formed on the upper face of the carrier body, the plurality of terminal electrodes electrically connecting an LSI chip to the internal conductor. A plurality of concave portions for electrically connecting a plurality of electrodes on a circuit substrate to the internal conductor are provided on the lower face of the carrier body, the concave portions being electrically connected to the internal conductor.
公开/授权文献
- US5031858A Apparatus and method for folding and locking rotor blades 公开/授权日：1991-07-16
信息查询
IPC分类:
