发明授权
- 专利标题: Pressure-sensitive adhesive material
- 专利标题(中): 压敏粘合剂材料
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申请号: US113515申请日: 1993-08-30
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公开(公告)号: US5631082A公开(公告)日: 1997-05-20
- 发明人: Toshifumi Hirose , Katsuhiko Isayama
- 申请人: Toshifumi Hirose , Katsuhiko Isayama
- 申请人地址: JPX Osaka
- 专利权人: Kanegafuchi Chemical Industry Co., Ltd.
- 当前专利权人: Kanegafuchi Chemical Industry Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX63/86585 19880407
- 主分类号: C09J7/02
- IPC分类号: C09J7/02 ; C09J201/10
摘要:
a tape or sheet form pressure-sensitive adhesive material which comprises a substrate which is obtainable by curing a curable resin composition comprising:(A) an organic elastomeric polymer which is liquid at room temperature and has, in a molecule, at least one silicon-containing group to the silicon atom of which at lease one hydroxyl group or hydrolyzable group is bonded and which is cross linkable through formation of a siloxane bond,(B) a curing catalystand(C) optionally a tackifier resin and a pressure-sensitive adhesive layer laminated on said substrate, which has good flexibility and increased adhesive force such as adhesive strength under shear and peel strength.
公开/授权文献
- USD432576S Organizer 公开/授权日:2000-10-24
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