发明授权
- 专利标题： Process for manufacturing lead frame for semiconductor package
- 专利标题（中）： 制造半导体封装引线框的工艺
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申请号： US557540申请日： 1995-11-14
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公开(公告)号： US5633206A公开(公告)日： 1997-05-27
- 发明人: Sang H. Kim , Sung M. Sim , In P. Hong , Sang G. Lee
- 申请人： Sang H. Kim , Sung M. Sim , In P. Hong , Sang G. Lee
- 申请人地址： KRX Suwon
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KRX Suwon
- 优先权： KRX1995-23471 19950731
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/495 ; H01L23/50 ; H01L21/60
摘要：
A process for manufacturing a lead frame having a pad, inner leads, outer leads and dambars, the lead frame being coated with a film on the back surface of the pad, which includes the steps of preparing a lead frame having a pad, inner leads and outer leads; placing a polyamic acid film on the back surface of the pad without using adhesive; and thermally compressing the polyamic acid film by using a heat; generator, to form polyimide film and simultaneously adhere that to the polyimide film the back surface of the pad.
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