Invention Grant
- Patent Title: Insulating resin-coated bonding wire
- Patent Title (中): 绝缘树脂涂层接合线
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Application No.: US398776Application Date: 1995-03-06
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Publication No.: US5639558APublication Date: 1997-06-17
- Inventor: Kohei Tatsumi , Hiroyuki Kondo , Michio Nitta , Shinya Nariki
- Applicant: Kohei Tatsumi , Hiroyuki Kondo , Michio Nitta , Shinya Nariki
- Applicant Address: JPX Tokyo
- Assignee: Nippon Steel Corporation
- Current Assignee: Nippon Steel Corporation
- Current Assignee Address: JPX Tokyo
- Priority: JPX6-040059 19940310
- Main IPC: H01L21/60
- IPC: H01L21/60 ; H01B3/30 ; H01B3/42 ; H01L23/49 ; B32B15/08 ; H01L23/29
Abstract:
The present invention provides a bonding wire having a good bonding property, no damage sustained to coatings during bonding, and capability of retaining an excellent insulating property even when wires come into impact with one another in the resin molding step, characterized in that the resin has a thermal weight loss at a temperature of 110.degree. C. in air of not less than 85% and an tensile strength at 180.degree. C. of not less than 300 kgf/cm.sup.2. The resins satisfying the specified characteristic conditions can be selected from the group consisting of polyparabanic acid based resins and polyarylate resins.
Public/Granted literature
- US4943798A Large truck remote wheel trouble warning system Public/Granted day:1990-07-24
Information query
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