发明授权
US5644085A High density integrated ultrasonic phased array transducer and a method
for making
失效
高密度集成超声波相控阵传感器及其制造方法
- 专利标题: High density integrated ultrasonic phased array transducer and a method for making
- 专利标题(中): 高密度集成超声波相控阵传感器及其制造方法
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申请号: US415895申请日: 1995-04-03
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公开(公告)号: US5644085A公开(公告)日: 1997-07-01
- 发明人: Peter William Lorraine , Venkat Subramaniam Venkataramani
- 申请人: Peter William Lorraine , Venkat Subramaniam Venkataramani
- 申请人地址: NY Schenectady
- 专利权人: General Electric Company
- 当前专利权人: General Electric Company
- 当前专利权人地址: NY Schenectady
- 主分类号: B06B1/06
- IPC分类号: B06B1/06 ; H04R17/00 ; H01L41/08
摘要:
The present invention discloses a high density integrated ultrasonic phased array transducer and method for making. The high density integrated ultrasonic phased array includes a backfill material having an array of holes formed therein. Each of the holes are separated a predetermined distance apart from each other and have a predetermined hole depth. Each of the holes contain a conducting material deposited therein forming a high density interconnect with uniaxial conductivity. A piezoelectric ceramic material is bonded to the backfill material at a surface opposite the array of conducting holes. Matching layers are bonded to the piezoelectric ceramic material. The surface opposite the array of conducting holes is cut through a portion of the matching layers, the piezoelectric ceramic material, and the backfill material, forming an array of isolated individual elements each having multiple electrical connections therein.