发明授权
- 专利标题： Matched low dielectric constant, dimensionally stable adhesive sheet
- 专利标题（中）： 匹配低介电常数，尺寸稳定的粘合片
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申请号： US418708申请日： 1995-04-07
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公开(公告)号： US5652055A公开(公告)日： 1997-07-29
- 发明人: David R. King , Gary C. Adler , Joseph E. Korleski , Michelle M. H. Waters
- 申请人： David R. King , Gary C. Adler , Joseph E. Korleski , Michelle M. H. Waters
- 申请人地址： DE Newark
- 专利权人： W. L. Gore & Associates, Inc.
- 当前专利权人： W. L. Gore & Associates, Inc.
- 当前专利权人地址： DE Newark
- 主分类号： C08J9/42
- IPC分类号： C08J9/42 ; C08L27/18 ; C09J7/02 ; H05K1/02 ; H05K1/03 ; H05K3/38 ; H05K3/46
摘要：
The present invention is an improved adhesive sheet (also known as a "bond ply," "bond film," or "prepreg") material suitable for bonding together electric circuit boards and other electrical components. The adhesive sheet of the present invention comprises a combination of a porous expanded polytetrafluoroethylene (PTFE), a ceramic filler, and a thermoset resin imbibed within the porous PTFE structure. By employing a fill of less than about 60% by weight of resin, the adhesive sheet has exceptionally good performance characteristics while being vastly easier to process.
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